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Features
General
• High-performance, Low-power secureAVR™ Enhanced RISC Architecture • • • • • •
– 137 Powerful Instructions (Most Executed in a Single Clock Cycle) Low Power Idle and Power-down Modes Bond Pad Locations Conforming to ISO 7816-2 ESD Protection to ± 6000V Operating Ranges: 2.7 to 5.5V Compliant with GSM, 3GPP and EMV 2000 Specifications; PC Industry Compatible Available in Wafers, Modules, and Industry-standard Packages
Memory
• 128K Bytes of ROM Program Memory • 36K Bytes of EEPROM, Including 128 OTP Bytes and 384-byte Bit-addressable Area
– 1 to 128-byte Program / Erase – 1.25ms Program / 1.